Picosun R-200 Advanced Atomic Layer Deposition, Edwards iXH 610 Dry Pump

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The agile design enables the highest quality ALD film depositions together with the ultimate system flexibility to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples is achieved thanks to our proprietary Picoflow™ technology. The PICOSUN® R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and patented remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, UHV systems, manual and automated loaders, cluster tools, powder chambers, roll-to-roll chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or might become later on.


Typical substrate size and type

  • 50-200 mm single wafers
  • 156 mm x 156 mm solar Si wafers
  • 3D objects
  • Powders and particles
  • Mini-batch
  • Porous, through-porous, and high aspect ratio (up to 1:2500)
Processing temperature and capacity
  • 50 – 500°C, plasma 450°C (650 °C with heated chuck on request)
Typical processes
  • Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, AlN, TiN, metals such as Pt or Ir
Substrate loading
  • Manual loading with a pneumatic lift
  • Load lock with magnetic manipulator arm
  • Semi-automatic loading with handling robot
  • Cassette-to-cassette loading with cluster tools

Additional information

Weight400 kg
Dimensions200 × 90 × 130 cm


ALD RD200 Advanced



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